Novel stacked capacitors
October 2025
Electrical Power & Protection
KYOCERA AVX, a leading global manufacturer of advanced electronic components engineered to accelerate technological innovation and build a better future, has released the new DSCC 25007 Mini BME stacks. These are miniature, high-CV stacked X7R capacitors equipped with base metal electrodes (BME) and subjected to 100% Group A testing.
Designed to satisfy the growing need for compact and lightweight high-CV SMT capacitors in high-reliability military, aerospace and space applications subjected to extreme operating conditions and harsh environments, the new fully-tested and traceable DSCC 25007 Mini BME stacks are based on the company’s proven MIL-PRF-32535 X7R capacitors.
The innovative series currently features two horizontally stacked X7R multilayer ceramic chip capacitors (MLCCs) in an EIA 2220 package that conserves board space, exhibits high-CV performance and allows design engineers to downsize from currently available components. It also exhibits low ESR, low impedance, high current handling capabilities and higher shock and vibration resistance than larger, heavier stacked capacitors. Additional features include a variety of lead frame options. These include standard 0,6 metre J and L styles and paddle, or single bar foot. The J and L styles are optimised for improved vibration resistance and are equipped with tin/lead plating.
The initial release of the DSCC 25007 Mini BME stacks is rated for operating temperatures extending from -55 to 125°C, and is available with three voltage ratings (25, 50 and 100 V) and nine capacitance values extending from 8,2 to 47µF ±20% tolerance.
Ideal applications for the series extend throughout the military, aerospace and space industries, and include satellites and satellite launchers, military missiles and aircraft, and input/output filtering circuits in power supplies.
“We’re very excited to release the new DSCC Mini BME stacks as they are engineered to solve design challenges that a growing number of our aerospace and defense industry customers have been wrestling with for the past few years. They’re currently unique to market,” said Michael Conway, senior product marketing manager at KYOCERA AVX. “Thanks to their compact and lightweight stacked form factor equipped with BME technology, these mini stacks deliver an unparalleled combination of high-reliability, high-capacitance and high-voltage performance, with substantial space and weight savings.
“When compared to an equivalent 100 V,10 µF part with precious metal electrodes (PME), they’re approximately 1/9th the weight and 1/6th the volume. Component weight directly impacts things like aircraft operating costs, satellite launch costs, missile performance and operating costs,” he says. “The new DSCC Mini BME stacks also come standard with 100% Group A testing.They utilise the inserts from our proven M32535 line and are fully traceable as well, which satisfies another common request for our aerospace and defense industry customers.”
The new DSCC 25007 Mini BME stacks are manufactured in a DLA approved, MIL-PRF-32535 qualified facility, and are fully traceable and subjected to rigorous testing to ensure high reliability and performance in extreme conditions and harsh environments. This specifically is 100% Group A testing, or 100% Group A and Group B testing for demanding designs with T-level requirements. Parts ship in waffle pack, tape and reel, or two-chip packaging.
Future expansions to the series will include a three-chip horizontal stack projected to launch by Q1 2026, followed by parts with three to 10 vertically stacked chips.
For more information, contact Michael Conway, KYOCERA AVX, +44 28 7034 0672, michael.conway@kyocera-avx.com, www.kyocera-avx.com
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