Heat losses of up to 200 W per slot and up to 3,2 kW with fully loaded shelves necessitate highly dynamic climate control solutions for Advanced TCA (Advanced telecom computing architecture), from board cooling to enclosure cooling.
The four, high-capacity RiCool III fans from Rittal, now available in a new, powerful generation, ensure enhanced safety and continuous availability, and provide reliable heat dissipation for the entire shelf up to 3,2 kW (below). With rising integration densities at all levels and clock frequencies of up to 10 GHz, even higher heat losses are to be expected in future. Innovations in climate control, such as liquid cooling of ATCA boards via CPU cooling or heat pipe concepts, are among Rittal's solutions for the effective cooling of hot spots, ensuring reliable dissipation of up to 70% of the heat loss.
In order to ensure adequate cooling of enclosures fully loaded with ATCA shelves, the LCP (liquid cooling package) is the final addition to Rittal's innovative range. One, two or three air/water heat exchangers (upgradeable at any time) with a cooling output of 4,0 kW each are housed in the LCP, which translates into a cooling output of 12 kW at maximum configuration. The climate control modules, which are housed in a side panel of the rack, convey the cold air directly in front of the shelves and create an optimum cooling effect inside the enclosure.
Advanced TCA is the latest standard for fast, complex tasks in telecommunication and data communication, medical technology, industrial automation, traffic technology as well as military/aerospace applications (above).
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