News


FieldComm Group announces release of FDI Package IDE and Common Host Components version 1.1

October 2015 News

The FieldComm Group has announced the release of the first update to its newest tool deliverables, the FDI Package IDE and the FDI Common Host Components. Version 1.1 of the development tools introduce exciting new capabilities for FDI product developers including an automated device package test tool, support for Profinet based device packages, and support for developing device packages capable of offline configuration, including upload and download features.

Since the dissolution of the FDI Cooperation, both PI International and FieldComm Group, as co-owners of the tools and components, have partnered together to support, maintain and enhance FDI products. Development of a single software product across all protocols will be performed at FieldComm Group in collaboration with PI International through the Group’s working group model.

FDI makes it easier for automation suppliers to develop and integrate intelligent devices because suppliers only need to create a single, unified package for each intelligent device that can work with all host systems and tools. This reduces overall development costs, while preserving and expanding existing functionality. Users will also find it easier to manage information from intelligent devices with a single device package, instead of managing multiple file types for disparate solutions and investing significant capital in custom integration efforts to connect multiple technology platforms.

The FDI Device Package IDE is a tool for device developers to create FDI packages and includes everything a host system needs to integrate the intelligent device into their system. With FDI, a single FDI device package makes it easier for device suppliers to develop and integrate their device across a wide range of host systems and protocols.

The FDI Common Host Components are software components for host system manufacturers that allows for rapid development and support of FDI device packages into their host systems. The components help system suppliers ensure they properly comply with the standard and consume device packages correctly. The FDI Common Host Components fully support both the new unified EDD file format as well as legacy EDD formats to protect end user investments.

For more information contact FieldComm Group, +27 (0)11 453 2468, [email protected], www.fieldbus.org





Share this article:
Share via emailShare via LinkedInPrint this page

Further reading:

Schneider Electric to become Official Energy Technology Partner of McLaren Racing
Schneider Electric South Africa News
Schneider Electric will become the Official Energy Technology Partner of McLaren Racing.

Read more...
Closing the skills gap: how WearCheck training boosts asset reliability
Wearcheck News
Condition monitoring specialist company, WearCheck is tackling the skills gap head on, offering a wide range of practical, hands-on courses that cover various topics related to condition monitoring and maintenance.

Read more...
Young SA scientists awarded medals at IRIS Global Symposium in India
News
Young local scientists have been awarded gold and silver medals at the recent Initiative for Research and Innovation in STEM global symposium in India, where they displayed their scientific brilliance.

Read more...
60 day reduction in Kriel outage earns Eskom innovation award for Steinmüller Africa
News
Steinmüller Africa’s crane-free rigging solution has shortened the Kriel Unit 6 outage by 60 days, earning the company’s site team the 2025 Eskom Kriel Managers Award for innovation.

Read more...
Buyout model for solar investment
News
Sustainable Power Solutions has introduced a buyout model that converts existing solar and battery systems into immediate capital for South African businesses.

Read more...
Innovation award for Beckhoff’s XTS machine
Beckhoff Automation News
The Premio Innovazione award has confirmed that Tetra Pak’s Cap Applicator 40 Speed Hyper has achieved a machine solution that pushes the boundaries of conventional packaging lines with a highly dynamic mechatronic solution based on XTS technology from Beckhoff.

Read more...
Vision meets reality at the Africa Automation Indaba
News
At the Africa Automation Indaba 2026, the panel ‘Automation for Africa – Opportunities, Challenges and Next Steps’ will feature a rare, high-level exchange where technology, ethics, entrepreneurship and data-driven reality shape what comes next for the continent.

Read more...
From the editor's desk: A tool not a crutch
Technews Publishing (SA Instrumentation & Control) News
Every year, the dictionaries try to summarise a year of human behaviour with a single word, the word of the year. You can question the value of this, but it’s quite entertaining. Words are important, ...

Read more...
Timken funds Kids Haven STEM classroom
News
A bright new chapter in digital education has begun at Kids Haven with the official opening of a fully equipped STEM classroom at the Kids Haven Village. This exciting addition was generously donated by Timken South Africa and expertly installed by Breadline Africa.

Read more...
Technology trends that will and won’t shape 2026
News
A whitepaper by ABI Research shows that a clear trend is taking shape, and 2026 is set to be characterised by practical, outcome-driven change.

Read more...









While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.




© Technews Publishing (Pty) Ltd | All Rights Reserved