Siemens Digital Industries Software has launched the latest advancement in its electronic systems design portfolio. The next-generation release takes an integrated and multidisciplinary approach, bringing together Xpedition software, Hyperlynx software, and PADS Professional software into a unified user experience that delivers cloud connectivity and AI capabilities to push the boundaries of innovation in electronic systems design.
The challenges of engineering talent shortages, supply chain uncertainties, and the increasing complexity of designs in the electronic systems design industry have impacted engineers and the development ecosystem, hindering their ability to meet the demands of modern electronics development.
Siemens’ electronic systems design solution aims to address these challenges head-on by delivering an intuitive, AI-enhanced, cloud-connected, integrated and secure solution to empower engineers and organisations in this dynamic environment.
“We are thrilled to announce the release of our next-generation electronic systems design solution, tailored to meet the critical needs of today’s electronics engineers and the wider engineering community,” said senior vice president, AJ Incorvaia. “This release represents our most thoroughly vetted solution to date, incorporating feedback from hundreds of participants. By unifying the Xpedition, HyperLynx and PADS Pro environments, and infusing this with AI, our customers will be ready to tackle their challenges head-on.”
Focused on providing highly intuitive tools to overcome talent shortages and enable engineers to quickly adapt, with minimal learning curves, the next-generation toolset adds predictive engineering and new support assistance using AI, enhancing engineers’ capabilities, streamlining and optimising their workflows. Cloud connectivity will facilitate collaboration across the value chain and provide access to specialised services and resources, enabling engineers to adapt to changing requirements rapidly, supply chain insights, and allow easier collaboration with stakeholders, regardless of location.
An integrated and multidisciplinary approach is vital for maximising efficiency and productivity. This solution will facilitate the seamless flow of data and information throughout the product lifecycle using digital threads. This integration fosters collaboration, informed decision making, and optimised designs.
“We are delighted to have collaborated with Siemens, providing feedback as an active user, as they have developed this next-generation toolset,” said Tom Pitchforth, vice president of Electronics Engineering at Leonardo. “Siemens has been a critical partner for us for over 20 years, and it is essential that our toolset providers align with our future needs, particularly in a rapidly changing and complex landscape. Our primary goals in leveraging the new toolset capabilities include strategic objectives such as enabling organisational flexibility, and tactical objectives such as achieving rapid time to productivity.
The next-generation software also brings enhanced integration with Siemens’ Teamcenter software for product lifecycle management and NX software for product engineering, allowing for multi-BOM support, and tighter collaboration between ECAD and MCAD domains. To prioritise security, it offers rigid data access restrictions that can be configured and geo-located, while adhering to the strictest industry protocols. Siemens maintains partnerships with industry-leading cloud providers to ensure robust security measures. The solution also includes design and verification requirements management for model-based systems engineering support.
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