Delivering advanced inline metrology to an expanding range of challenging industries, SmartRay is launching the smallest field-of-view 3D sensor of its cutting-edge ECCO X series.
The new ECCO X 012 model represents a game-changing development for high-precision automated inspection in applications such as BGA (Ball Grid Array) inspection, printed circuit board assembly (PCBA) inspection and wafer inspection as well as medical applications and other small field of view (FOV) applications.
With a FOV of 12 mm at mid-field and up to 13 mm at far-field, and a measurement range (MR) of 6 mm, the ECCO X 012 creates unprecedented opportunities for more precision manufacturing operations to benefit from the evolution in 3D laser triangulation technology in the accurate inspection of smaller components.
The SmartRay sensor’s small FOV enables a lateral resolution of 2,7 to 3,2 µm. It has a scan rate of up to 40 kHz and provides 4096 3D points of resolution per profile, delivering up to 163 million points/sec.
The sensor also offers the more intense Laser Class 3R as standard, which is more than five times stronger than the Class 2 laser, increasing the previously possible scan speed by reducing the exposure time.
Consistent with the current models − the ECCO X 100 and the ECCO X 025 3D sensors − of the expanding SmartRay premium X series, the latest addition to the family delivers 100% inspection at metrology grade level to meet the highest inspection demands.
The ECCO X 012 combines the characteristic exceptional resolution and speed of the X series with a smaller FOV and MR to offer specific benefits for wafer inspection applications, including chip measuring, chip seating and die chipping as well as in PCBA inspection, such as components alignment, chip height measurement, terminal pin bending and solder paste quality.
The sensor is also ideal for medical applications with the capability to scan injection needles with varying diameters and for inspecting the small shiny, metallic objects prevalent in electronics and semi-conductor wire bonding.
Measuring only 48 mm x 124,5 mm x 103 mm and weighing only 800 g, the compact ECCO X 012 offers easy mounting onto existing inspection systems and simple integration into machines.
Clare Rathsack, business unit manager at ECCO Sensors, said: “We are proud to introduce the ECCO X 012 as the latest addition to the expanding SmartRay X series. With its significant potential to facilitate high-precision automated inspection in more applications, our latest innovation is a further demonstration of how our ground-breaking 3D sensors are making inline metrology possible. “With the smallest FOV in the series, the ECCO X 012 redefines the boundaries of the technology by bringing 3D laser triangulation to the physical edges of the component or part for precision measurement. It fulfils industry demand for resolution and speed for small field-of-view applications where previously 3D laser triangulation may not have been a viable option, enabling more companies to benefit from improved product quality, to guide automation and reduce production costs.”
SmartRay delivers reliable 3D measurements with precise reliability with the ECCO sensor range.
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