Turck's new Q14 and Q20 Q-Pak capacitive sensors feature a compact rectangular housing that fits and functions where standard barrel sensors will not. Q14 and Q20 sensors, capable of 'seeing through' lower dielectric materials to detect higher dielectric materials, are ideal for applications such as level detection, package inspection, carton contents detection, wire-break detection, parts rejection, stack level control and packaging.
The new sensors measure 52,0 or 68,0 mm high, by 30,0 or 40,0 mm wide, by 14 or 20 mm deep, depending on model and achieve a 10 or 20 mm sensing range.
Outstanding performance is possible, even when fully embedded in steel. The long sensing range allows the devices to be mounted farther from the sensing target to minimise sensor damage and replacement costs.
A sensitivity adjustment allowing the user to reliably detect various target materials. They also feature a compensation electrode that minimises false output due to contamination on the sensor face. The compensation circuitry ignores splashing water and dust build-up, which are common in capacitive sensor applications.
Green and yellow LEDs indicate 'power on' and 'output energised' to keep users constantly informed of operating status. Both of these three-wire DC, 10-65 V d.c. sensors feature integral circuitry that protects against short-circuit, overload, wire-break and reverse polarity. These devices are available with complementary NPN (sinking) or PNP (sourcing) outputs.
Designed for use in industrial environments, Q14 and Q20 sensors feature a durable PBT plastic housing and chrome-plated brass connector. They operate in temperatures from -25 to +70°C at 10% temperature drift and are rated IEC IP67. Both models are completely flush-mountable and available with a potted-in 2 m PVC-jacketed cable or a choice of picofast or eurofast quick-disconnect connector.
Turck capacitive sensors reliably detect all metallic and nonmetallic materials, including metal, water, wood, glass, cardboard, plastic, concrete block, glue, thin wire, silicon wafers and numerous other materials.
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